- Vesper MEMS
- $114,200.00 -163,970.00/year*
Responsibilities: Work with Semiconductor Assembly Sub-Contract Organizations for technical issues. Design and Manage Engineering Runs through Sub-Contract Assembly Manufacturers. Work with product development teams to translate new product specifications into manufacturable package design. Develop and improve methods to measure and evaluate package processes and features through modeling and simulations. Apply statistical process control (SPC) methodologies to monitor and improve production processes Optimize package processes for quality and yield Contribute to the innovation of advanced package solutions, new material development, and specs. Qualifications: BS degree in Engineering or Science. MS preferred. 0 to 2 years of work experience in semiconductor manufacturing Familiar with assembly and packaging processes e.g, Molding, Metallization, Bumping/Wire-bonding, Wafer/Die Dicing and Laminate, a plus. Good understanding of packaging materials, reliability standards, FA techniques, etc. a plus. Basic understanding of Design for Manufacturability and requirements needed to ramp technologies in a high-volume manufacturing environment a plus. Strong written and spoken communication skills. Ability to creatively solve problems in a fast-paced production environment Ability to work & effectively interact (remotely, as needed) with sub-contractors
Willing to work in Downtown Boston, MA.
Candidates must be authorized to work in the United States
Associated topics: assemble, assembler, assembly, installation, reassemble, re assemble
* The salary listed in the header is an estimate based on salary data for similar jobs in the same area. Salary or compensation data found in the job description is accurate.
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