Overview Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets as IoT, Automotive, 5G. This team is responsible for roadmapping, working with OSATs, suppliers, internal design and product teams as well as NPI. Team is looking for experienced packaging engineer who has worked with various packaging and substrate technologies Flipchip, Wirebond, CSP, WLP, PoP, SIP/Module packages SIP/Module and integration lead experience will be a plus. All Qualcomm employees are expected to actively support diversity on their teams, and in the Company. Minimum Qualifications
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
5+ years Hardware Engineering experience or related work experience.
3 - 10 yrs of experience working in a semiconductor packaging environment for consumer products.
Understanding of semiconductor package manufacturing process - Substrate manufacturing, SIP/modules, wafer bumping, wafer handling, flipchip, wirebond, Underfill, Molding, SMT and other packaging technologies.
Understanding of organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
Knowledge in DOE , Control Plan , FMEA and other statistical Process control method.
Good oral communication, strong team player & project management skills.
Knowledge of AutoCAD, JMP and MS Office.
Hand-on experience at manufacturing floor is a plus.