Overview The candidate will work in the RFFE (RF Front-End) Department of Qualcomm Technologies. The position offers the opportunity to work on the development of RF Front-End Module to ensure design win and manufacturing success. Qualcomm solutions include highly customized LNAs, PAs, FEMs, antenna tuner and multi-throw switches in standalone and module packages for 4G and 5G wireless cell phone and ultra-mobile devices. The RF New Product Introduction (NPI) Engineer will bring the designs to manufacturability in a fast-paced worldwide team environment, and is required to work closely with RF design, process development, integration, testing, quality, and reliability teams to ensure the product transition from design to manufacturing. Responsibilities:
Lead complex and diverse RF module from early R&D to initial stage of High Volume Manufacturing(HVM)
Contribute to the success of module release through: --- Supporting customer design win in early customer engagement stage.--- Ensure a low risk, high yield initial product ramp-up.
Understand underlying physics of the front end content of the RF modules: Acoustic filters, switches, PA, LNAs, etc.
Collect wafer level, die level, and module level measurements. Either using existing tools or writing a program/script to automate data collection.
Analyze, visualize, and identify correlation factors.
Provide data driven recommendation on identifying risks, and propose/implement solutions to mitigate them.
Automate dashboards to monitor content status and risks against sampling and release schedules.
Simulate and replicate failure modes, and help direct FA teams.
Communicate data findings and results throughout all involved teams. Lead activities and define open items through a data driven approach.
Identify areas for cost savings, efficiency improvements, and early risk avoidance scenarios.
Provide documentations, propose checklists for risk mitigation items all across product portfolio.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company. Minimum Qualifications
Bachelor's degree in Science, Engineering, or related field.
2+ years ASIC design, verification, or related work experience.
PhD in any of RF/ RF MEMS / or RF Acoustics with 1-3+ years of experience in related field
Scientific programming: Python, Matlab
Excellent communication skills: multi-disciplinary international team communication skills is a must.
Education Requirements Required: Bachelor's degree in Science, Engineering, or related field Preferred: PhD in any of RF/ RF MEMS / or RF Acoustics Keywords
Associated topics: architecture, asic, chip, design engineer, engg, engineer ii, engineer iii, pcb, rf, schema
* The salary listed in the header is an estimate based on salary data for similar jobs in the same area. Salary or compensation data found in the job description is accurate.