Req. ID: 131159 Micron Technology's vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community. As a DRAM Product Engineer, you will be responsible to ensure our future array circuit architectures and timings will be effective, consistent, and manufacturable across all DRAM products. Will work with Design, Process, & other PE teams to create circuits and define requirements to ensure our future DRAM scaling roadmap plans are successful. Responsibilities and Tasks:\"Voice to Design\" on array core design requirements.Help create and define requirements for array core solutions on future products and process nodes. DFM is key focus.Develop strategies to support future process roadmap requirements through test chip definition and silicon validation.Comprehend our competition trends, product portfolio trends and overlay with our circuit and product roadmaps. Look for opportunities to drive competitive advantages and to identify potential future gaps that need attention.Help drive standardization of key array circuits across all DRAM families and process nodes. Required Experience:3+ years of PE, PYE, or Design experience. Education:BSEE or greaterABehaviors:Strong understanding of array core architectures and circuits. Current or past circuit design experience a plus.Hspice, finsim evaluations for circuit performance and creation.Good DFT/DFM understanding with knowledge of PROBE and Backend testflowsStrong communication skills with ability to convey complex technical concepts to peers and management.Will be setting standards which requires building consensus with Design, other PE groups, TD, and TPCE.Experience with shell scripts and data extraction of production datauMATE & wafer bench data gathering experienceExperience and understanding MFG process flows / Layout / Defect analysisExperience with Automated Test Equipment (C1D, Advantest, AMBYX ) a plusFullchip simulation experience a plusAnalog circuit design and/or verification experience a plus About Us As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands Micron, Crucial and Ballistix we offer the industry's broadest portfolio. We are the only company manufacturing today's major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world. Micron Benefits Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran's status, or other classifications protected under law. This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.To request assistance with the application process, please contact Micron's Human Resources Department at 1-800-###-#### (or 208-###-####).Keywords: Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || Experienced || Regular || Engineering || Not Applicable || Associated topics: bsee, design, firmware, rtos, semiconductor, smt, soc, surface mount, ttl, vlsi
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